UNIQUE BUSINESS IDENTIFIER
UBI 52644563
Live BRN: 52644563 CR: 1481166 Established 16 Years

Vbond Semiconductor Materials Limited

伟邦材料有限公司

Record Updated: 2022-07-05
Inquiries: 125 Views
Jurisdiction: Hong Kong SAR

Vbond Semiconductor Materials Limited (偉邦材料有限公司) is a Hong Kong corporation duly incorporated under the Companies Ordinance (Cap. 622). Its official Company Registration Number (CR) is 1481166, and Business Registration Number (BRN) is 52644563, classified as a Private company limited by shares. Incorporated on 2010-07-16, the entity has maintained continuous statutory operations for 16 years, currently holding an active legal status of Live. The registered office is situated at RM B 4/F GOLD KING INDUSTRIAL BLDG, 35-41 TAI LIN PAI RD, KWAI CHUNG NT, HONG KONG. You may search and order official filing extracts (NAR1/NNC1/ND2A) or request a full commercial due diligence report for Ultimate Beneficial Owner (UBO) penetration.

I. Corporate Profile & Statutory Registry Records

Statutory Registry Dossier
Official Chinese Name 偉邦材料有限公司 Official English Name Vbond Semiconductor Materials Limited
Business Reg No. (BRN) 52644563 Company Reg No. (CR) 1481166
Company Category Private company limited by shares Incorporation Date 2010-07-16
Current Legal Status Live Statutory Filing Cycle 2026-07-16
Registered Office Address
RM B 4/F GOLD KING INDUSTRIAL BLDG, 35-41 TAI LIN PAI RD, KWAI CHUNG NT, HONG KONG
Significant Controllers (SCR) Pursuant to Part 12 Division 2A of Cap. 622, SCR records are kept at the registered office. Order our Due Diligence Report to penetrate UBO controllers.

II. Companies Registry Statutory Image Records

Statutory Document Index (Cap. 622)
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Hong Kong Companies Registry Official Filing Retrieval

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III. Commercial Due Diligence & Regulatory Risk Screening

360° Risk & Compliance Verification
Statutory Licences (32 Regulators) Standard
No active licences recorded under 32 statutory regulators. Operates as general commercial corporation.
Court Litigation & Dockets Judiciary Registry
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Insolvency & Winding-Up ORO Cap. 6
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Office & Address Verification Address Verified
RM B 4/F GOLD KING INDUSTRIAL BLDG, 35-41 TAI LIN PAI RD, KWAI CHUNG NT, HONG KONG
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